EAI SmartSP 2026: 4th EAI International Conference on Security and Privacy in Cyber-Physical Systems and Smart Vehicles 2026 Detroit, MI, United States, November 5-6, 2026 |
| Conference website | https://smartsp.eai-conferences.org/2026/ |
| Submission link | https://easychair.org/conferences/?conf=eaismartsp2026 |
| Submission deadline | April 1, 2026 |
Recent proliferation of Artificial Intelligence (AI), Internet of Things (IoT), edge-fog-cloud computing, and interconnected networks envisions that smart cyber-physical systems (CPS), especially smart vehicles (SV), are capable of innovative solutions to change our lifestyles. Unavoidably, the potential benefits come along with new challenges and concernsaboutn security and privacy. The 4th EAI International Conference on Security and Privacy in Cyber-Physical Systems and Smart Vehicles (EAI SmartSP 2026) is a global forum for researchers and developers from academia, industry, and government to present and discuss emerging ideas and trends in security and privacy issues in this exciting area. SmartSP 2026 seeks original/invited papers focusing on theoretical analysis, vulnerability discovery, novel system architecture construction and design, emerging applications, experimental studies, and social impacts of CPS and SV. Both review/survey papers and technical papers are encouraged. SmartSP 2026 also welcomes short papers that summarize speculative breakthroughs, work-in-progress, industry-featured projects, open problems, new application challenges, visionary ideas, and preliminary studies.
Submission Guidelines
Papers should be submitted through the EasyChair system, and have to comply with the Springer format (see Author’s kit section).
- Full/ Regular papers should be 12-20 pages in length. (Excluding appendices, references, appreciation, etc.)
- Short papers should be 6-11 pages in length. (Excluding appendices, references, appreciation, etc.)
*Please note that additional pages will be subject to an extra charge for each extra page uploaded.
All conference papers undergo a thorough peer review process prior to the final decision and publication. This process is facilitated by experts in the Technical Program Committee during a dedicated conference period.
Committees
Technical Program Committee Chairs
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Dave Tian, Purdue University, USA
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Habeeb Olufowobi, University of Texas at Arlington, USA
Organizing committee
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General Chair: Qiben Yan, Michigan State University, USA
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General Co-Chair: Mert D. Pesé, Clemson University, USA
Contact
All questions about submissions should be emailed to Conference support - conferences@eai.eu.
