2026 IEEE 18th International Conference on Solid-State and Integrated Circuit Technology will be held on Oct. 27 - 30, 2026 in Hangzhou, China.

The ICSICT-2026 conference is the 18th in the series aiming to provide an international forum for the presentation and discussion of recent advances in solid-state and integrated circuit technology. The conference will be held on Oct. 27 - 30, 2026 in Hangzhou, China. All aspects of solid-state devices, circuits and systems, process technologies, materials and other related research are within the scope of the conference. Over the course of four days, a rich program of contributed and invited presentations will cover the latest advancements in various fields. These presentations will be delivered through both oral and poster sessions, accompanied by panel discussions addressing cutting-edge technology issues and various engaging activities. This comprehensive program aims to foster extensive opportunities for the exchange of technical information and create a stimulating atmosphere for mutual communication among all participants. The presentation of the Excellent Student Paper Award and the Outstanding Young Scholar Paper Award will take place during the conference's closing ceremony. Enterprises with relevance to the event are encouraged to join and actively take part in the exhibition.

Submission Guidelines

Prospective authors are requested to submit 3 pages camera-ready full length paper in English for proceedings publication.

Accepted papers will be submitted for inclusion into IEEE Xplore subject to meeting IEEE Xplore's scope and quality requirements and can be retrieved by EI.

List of Topics

• Advanced Silicon Devices
• Compound Semiconductor Devices
• Advanced Process Technologies
• Device Modeling & Simulation
• Process Modeling & Simulation
• Microwave, Millimeter Wave Devices & Circuits
• Wireless System Building Blocks
• ADC/DACs for Wireless Systems
• Nonlinear Circuits for Wireless Systems
• Integrated Passive Device & Circuits
• ...etc

Committees

Life Honorary Chair

• Yangyuan Wang, Peking University, China

General Co-Chairs

• Yuehang Xu, University of Electronic Science and Technology of China, China
• Wei Zhang, Fudan University, NICIC, China
• Bin Zhao, IEEE EDS, USA
• Francois Rivet, University of Bordeaux, France
• Mengqi Zhou, IEEE Beijing Section, China
• Ting-Ao Tang, Fudan University, China
• Huihua Yu, Fudan University, China

Advisory Committee Co-Chairs

• Chenming Hu, University of California, Berkeley, USA
• Cor Claeys, Katholieke Universiteit Leuven, Belgium
• K.N. Tu, University of California, Los Angeles, USA
• Hiroshi Iwai, National Yang Ming Chiao Tung University, Japan

Contact

Conference Secretary: Joyce

Tel.: +86-18628263876 

 Email: icsict2025@csj.uestc.edu.cn